藍(lán)寶石精密切割裂片機(jī)

Sapphire Material Cutting Machine

產(chǎn)品簡介：

采用紅外皮秒激光器，保證完 美光束質(zhì)量，光斑細(xì)，切割精度高。

IR picosecond laser is used to ensure perfect beam quality, fine spot and high cutting precision

產(chǎn)品亮點(diǎn)：

可兼容振鏡和聚焦頭兩種裂片方式

Compatible with galvo and focusing head

兼容多款國內(nèi)外激光器型號(hào)，可添加CCD定位等功能模塊

Compatible with a variety of domestic and overseas laser models

Optional customized CCD solution and other functional modules can be added

高速XY運(yùn)動(dòng)平臺(tái)，大程度提升加工速度

High speed XY platform ensures stability under high speed processing

可切割有油墨與鍍膜藍(lán)寶石

Minimum ink offset when cutting Sapphire with deco

實(shí)現(xiàn)無錐度切割，邊緣光滑，崩邊少

Realize no taper cutting, smooth edge and minimized chipping

性能參數(shù)：

應(yīng)用領(lǐng)域：

0.3mm-5mm厚度光玻璃，手機(jī)蓋板、手表蓋板、玻璃logo的切割倒角工藝

0.3mm-2mm sapphire, phone cover, watch cover, camera protective glass, optic protective cover filamentation and separation