公司簡介：
美國MTI公司為半導體行業硅片幾何參數測量技術-電容探頭領域的佼佼者，與昔日的ADE齊名：為世界半導體業硅片幾何參數測量的標準測試設備；為納斯達克上市企業。
儀器簡介：
主要參數：
1. Diameter: 150mm,200mm,300mm
2. Material: All semiconducting,and semi-insulating matrrials
3.Surfaces: As-Cut, Lapped, Etched,Polished,Patterned; Bare wafer/Quartz Base,Tape
4.Thickness: (ASTM F533),Range-+/-500um;Accracy-+/-0.25um; Repeatability-0.050um
5.TTV: (ASTM F533) Range-+/-500um; Accuracy-+/-0.050um; Repeatablity-0.050um
6.Bow:(ASTM F1390) Range-+/-250um; Accuracy-+/-2.0um; Repeatabiligy-0.75um
7.Flatness(Global)(ASTM F1530) Rang:8mm; Accuracy-+/-0.05um; Repeatbility-0.030um
8.Flatness(Site)(ASTM F1530) Rang:8mm; Accuracy: +/-0.05um; Repeatbiligy:0.030um
設備：
Proforma 300SA：半自動ZUI大12寸晶圓幾何參數測量儀；
Proforma 200SA：半自動型ZUI大8寸晶圓幾何參數測試儀；
測試數據/結果例子：
| 23-Sep-2013 | Wafer Summary Report | Page: | 1.00 | |||||||||||||||||||||||
| Operator: | Administrator | Lot Number: | DK Wafer 200mm | Passed: | 4 | |||||||||||||||||||||
| Measurement Date: | 09/23/2013 | Recipe: | 200mm,33,m,1notch,1-29-13 1 run | Failed: | 0 | |||||||||||||||||||||
| Measurement Time: | 17:51:58 | Yield: | 100.0 | % | ||||||||||||||||||||||
| Wafer | Wafer | Center | Avg | Min | Max | 3PT | LSQ | 3PT | LSQ | Max | Max | Max | Max | Max | Max | Max | Max | % Sites | ||||||||
| Number | ID | Thickness | Thickness | Thickness | Thickness | TTV | Bow | Bow | Warp | Warp | Sori | GBIR | GF3R | GFLR | GBID | GF3D | GFLD | SBIR | SF3R | SFLR | SFQR | SBID | SF3D | SFLD | SFQD | Passed |
| (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | (uM) | ||
| Low Limit | ||||||||||||||||||||||||||
| High Limit | ||||||||||||||||||||||||||
| 1.00 | shiny side | 729.56 | 729.15 | 728.83 | 729.65 | 0.82 | -0.20 | -2.21 | 18.32 | 17.74 | 17.72 | 0.82 | 0.76 | 0.75 | 0.82 | 0.63 | 0.48 | 0.29 | 0.30 | 0.30 | 0.13 | 0.21 | 0.20 | 0.20 | 0.07 | 100.00 |
| 2.00 | dull side | 729.60 | 729.14 | 728.77 | 729.73 | 0.96 | 3.85 | 5.59 | 17.34 | 17.32 | 17.56 | 0.96 | 0.77 | 0.77 | 0.96 | 0.64 | 0.54 | 0.32 | 0.34 | 0.34 | 0.19 | 0.26 | 0.25 | 0.25 | 0.13 | 100.00 |
| 3.00 | shiny side | 729.52 | 729.10 | 728.77 | 729.61 | 0.84 | 0.33 | -1.55 | 16.75 | 17.30 | 17.27 | 0.84 | 0.75 | 0.74 | 0.84 | 0.61 | 0.48 | 0.34 | 0.33 | 0.33 | 0.13 | 0.19 | 0.19 | 0.19 | 0.09 | 100.00 |
| 4.00 | dull side | 729.54 | 729.10 | 728.76 | 729.68 | 0.92 | 3.29 | 5.34 | 17.21 | 17.29 | 17.53 | 0.92 | 0.79 | 0.76 | 0.92 | 0.61 | 0.53 | 0.29 | 0.27 | 0.28 | 0.18 | 0.27 | 0.26 | 0.26 | 0.10 | 100.00 |
| Minimum | 729.52 | 729.10 | 728.76 | 729.61 | 0.82 | -0.20 | -2.21 | 16.75 | 17.29 | 17.27 | 0.82 | 0.75 | 0.74 | 0.82 | 0.61 | 0.48 | 0.29 | 0.27 | 0.28 | 0.13 | 0.19 | 0.19 | 0.19 | 0.07 | 100.00 | |
| Maximum | 729.60 | 729.15 | 728.83 | 729.73 | 0.96 | 3.85 | 5.59 | 18.32 | 17.74 | 17.72 | 0.96 | 0.79 | 0.77 | 0.96 | 0.64 | 0.54 | 0.34 | 0.34 | 0.34 | 0.19 | 0.27 | 0.26 | 0.26 | 0.13 | 100.00 | |
| Average | 729.56 | 729.12 | 728.78 | 729.67 | 0.89 | 1.82 | 1.79 | 17.41 | 17.41 | 17.52 | 0.89 | 0.77 | 0.76 | 0.89 | 0.62 | 0.51 | 0.31 | 0.31 | 0.31 | 0.16 | 0.23 | 0.23 | 0.23 | 0.10 | 100.00 | |
| Std Dev | 0.030 | 0.022 | 0.028 | 0.044 | 0.056 | 1.772 | 3.681 | 0.573 | 0.190 | 0.162 | 0.056 | 0.015 | 0.012 | 0.056 | 0.014 | 0.025 | 0.022 | 0.029 | 0.025 | 0.025 | 0.032 | 0.029 | 0.030 | 0.021 | 0.000 | |
200SA/300SA操作界面，3D圖形貌顯示
技術參數：
1. Diameter: 150mm,200mm,300mm
2. Material: All semiconducting,and semi-insulating matrrials
3.Surfaces: As-Cut, Lapped, Etched,Polished,Patterned; Bare wafer/Quartz Base,Tape
4.Thickness: (ASTM F533),Range-+/-500um;Accracy-+/-0.25um; Repeatability-0.050um
5.TTV: (ASTM F533) Range-+/-500um; Accuracy-+/-0.050um; Repeatablity-0.050um
6.Bow:(ASTM F1390) Range-+/-250um; Accuracy-+/-2.0um; Repeatabiligy-0.75um
7.Flatness(Global)(ASTM F1530) Rang:8mm; Accuracy-+/-0.05um; Repeatbility-0.030um
8.Flatness(Site)(ASTM F1530) Rang:8mm; Accuracy: +/-0.05um; Repeatbiligy:0.030um
主要特點：
1. Diameter: 150mm,200mm,300mm
2. Material: All semiconducting,and semi-insulating matrrials
3.Surfaces: As-Cut, Lapped, Etched,Polished,Patterned; Bare wafer/Quartz Base,Tape
4.Thickness: (ASTM F533),Range-+/-500um;Accracy-+/-0.25um; Repeatability-0.050um
5.TTV: (ASTM F533) Range-+/-500um; Accuracy-+/-0.050um; Repeatablity-0.050um
6.Bow:(ASTM F1390) Range-+/-250um; Accuracy-+/-2.0um; Repeatabiligy-0.75um
7.Flatness(Global)(ASTM F1530) Rang:8mm; Accuracy-+/-0.05um; Repeatbility-0.030um
8.Flatness(Site)(ASTM F1530) Rang:8mm; Accuracy: +/-0.05um; Repeatbiligy:0.030um
上傳人：賽倫科技（北京）有限責任公司
大?。? B
1558
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